Intel, a frontrunner in the chip packaging industry, is setting ambitious goals for the future. The company is targeting the creation of a chip containing a trillion transistors by 2030, surpassing the expectations set by Moore’s Law. Intel’s CEO, Pat Gelsinger, envisions a paradigm shift with “Super Moore’s Law” or “Moore’s Law 2.0,” where transistor counts could potentially exceed the traditional pace by 2031. This significant upgrade is expected to be facilitated by Intel’s collaboration with TSMC and Samsung Foundry, utilizing a cutting-edge 2nm node.
Gelsinger acknowledged the historical challenges faced in maintaining Moore’s Law, stating, “I think we’ve been declaring the death of Moore’s Law for about three to four decades.” While the rate of doubling transistors has slowed to approximately every three years, he expressed optimism about a new era of accelerated progress. The impending advancements signal a departure from the golden era of Moore’s Law, and Gelsinger emphasized the increased difficulty in achieving regular doublings.
Intel is charting a course to achieve the remarkable milestone of one trillion transistors on a chip by 2030. This ambitious target is part of a broader strategy that involves embracing advanced packaging techniques and heterogeneous integration to maximize transistor density. Technologies such as RibbonFET, inspired by Samsung’s 3nm production, are integral to this vision. RibbonFET covers all four sides, effectively reducing current leakage. Additionally, PowerVIA Power Delivery, a technique relocating power supply lines to the rear of the chip, is anticipated to enhance overall performance.
Intel’s pursuit of a trillion transistors necessitates the adoption of innovative technologies. Advanced packaging and cutting-edge integration methods are pivotal in realizing this monumental goal. However, Gelsinger highlighted the substantial economic implications, noting that the cost of a modern fab has doubled over the past seven to eight years, reaching approximately $20 billion. This shift underscores the substantial investment required to push the boundaries of technological innovation.
Intel’s commitment to pushing the boundaries of chip technology is evident in its quest to achieve a trillion transistors by 2030. The introduction of “Super Moore’s Law” and strategic partnerships with TSMC and Samsung Foundry underscore the company’s determination to propel the industry forward. While the challenges are formidable, Intel’s focus on advanced packaging and innovative technologies signals a new era of possibilities in chip development. As the technological landscape evolves, Intel is poised to play a pivotal role in shaping the future of semiconductor innovation.
