At the Mobile World Congress 2024, Qualcomm made several exciting announcements, including the introduction of the FastConnect 7900 and Snapdragon X80 5G, as well as the Qualcomm AI Hub.
The FastConnect 7900 is a powerful connectivity solution that integrates Wi-Fi 7, Bluetooth 5.4, and Ultra Wideband (UWB) technologies. Built on a 6nm process node, it offers 40% lower power usage compared to its predecessor, the 7800. With UWB, Wi-Fi Ranging, and Bluetooth Channel Sounding all in one chip, the FastConnect 7900 enables secure device discovery, access, and control for digital keys, object finding, and indoor navigation applications. This innovative chip is set to launch commercially in the second half of 2024.
Qualcomm’s latest modem, the Snapdragon X80 5G, supports 6x carrier aggregation for sub-6GHz bands, delivering peak 5G download speeds of 10 Gbps and 3.5 Gbps upload speeds. It also features “fully integrated” NB-NTN satellite communications support. With support for 3GPP Release 17 and Release 18, the Snapdragon X80 is designed to be software updatable to support future advancements in 5G technology. Its AI processor, or tensor accelerator, enhances data speeds, latency, quality of service, coverage, location accuracy, spectrum efficiency, power efficiency, and multi-antenna management. The first devices powered by the Snapdragon X80 are expected to launch in the second half of 2024.
In addition to the connectivity offerings, Qualcomm also introduced the Qualcomm AI Hub. This library provides developers with access to pre-optimized AI models for Snapdragon-powered devices. With over 75 popular AI and generative AI models available, developers can leverage models like Whisper, ControlNet, Stable Diffusion, and Baichuan 7B to enhance on-device AI performance, reduce memory utilization, and improve power efficiency. The Qualcomm AI Hub is accessible through GitHub and Hugging Face, offering developers flexibility across different form factors and runtimes.
These announcements from Qualcomm demonstrate their commitment to advancing connectivity and AI technologies, paving the way for exciting innovations in the near future.
